Magnetron cathode sputtering technology on parts of more or less complex shape (2D parts, up to A4 and 3D format) allows the development of high quality deposits.

Environmentally friendly, it allows the deposition of thin layers of a wide variety of compositions on a wide variety of materials (metals, ceramics, polymers, glasses, etc.) at low temperatures (up to 50°C) , Operation can be done as desired:
• Combination of the advantages of magnetron sputtering (uniform and precise composition of the layers, wide range of achievable compositions, absence of defects on the surface of the deposits, etc.);
• Operation either:
- in PVD (Physical Vapor Deposition) mode,
- in mixed PACVD (Plasma Assisted Chemical Vapor Deposition) / PVD mode,
- under plasma for carrying out duplex treatments (example: plasma nitriding followed by hard deposition);
• Independent adjustment of ion flow and energy, allowing optimization of deposition parameters for all types of hard layers;
• Homogeneous stripping of parts and, simultaneously, cleaning of the targets necessary to obtain high adhesion and precise composition of the layers

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